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| SMT (Surface Mount Technology)
Is a process by which electronic components are mounted directly on both sides of a printed circuit board, increasing board capacity, facilitating product miniaturization and enable advanced automation of production.
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COB (Chip On Board)
Is a technology that utilizes wire bonding to connect large-scale integrated circuits directly to printed circuit boards.
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OLB (Outer Line Bonding)
Is an advanced technology used to connect PCBs and large-scale integrated circuits with a large number of connectors.
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BGA (Ball Grid Array)
Is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds. Soldering of BGA devices requires precise control and is usually done by automated processes
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FPC Assembly
Is an assembly method for bonding electronic components onto a flexible printed circuit.
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Finished product assembly and packaing
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